MC7457RX1267LC Datasheet, PDF (47/71 Pages) Freescale Semiconductor, Inc – Microprocessor

Package Description
8.4 Package Parameters for the MPC7457, 483 CBGA or RoHS BGA
The package parameters are as provided in the following list. The package type is 29 × 29 mm, 483 ceramic
ball grid array (CBGA).
Package outline
29 × 29 mm
Interconnects
483 (22 × 22 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height —
Maximum module height3.22 mm
Ball diameter
0.89 mm (35 mil)
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
47