MC7457RX1267LC Datasheet, PDF (45/71 Pages) Freescale Semiconductor, Inc – Microprocessor

Package Description
8.2 Mechanical Dimensions for the MPC7447, 360 CBGA
Figure 20 provides the mechanical dimensions and bottom surface nomenclature for the MPC7447, 360
CBGA package.
A1 CORNER
D
D3
D1
D2
2X
0.2
B
E3
E
E4
E2
E1
2X
0.2
C
e
D4
1 2 3 4 5 6 7 8 9 10 111213141516 171819
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
360X b
0.3 A B C
0.15 A
Capacitor Region
0.15 A
NOTES:
1. DIMENSIONING AND
TOLERANCING PER ASME
Y14.5M, 1994.
A ^{2. DIMENSIONS IN}
MILLIMETERS.
3. TOP SIDE A1 CORNER
INDEX IS A METALIZED
FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1
CORNER IS DESIGNATED
WITH A BALL MISSING
FROM THE ARRAY.
A3
A
0.35 A
A2
A1
Millimeters
DIM MIN MAX
A
2.72 3.20
A1 0.80 1.00
A2 1.10 1.30
A3
—
0.6
b
0.82 0.93
D
25.00 BSC
D1
— 11.3
D2
8.0
—
D3
—
6.5
D4 10.9 11.1
e
1.27 BSC
E
25.00 BSC
E1
— 11.3
E2
8.0
—
E3
—
6.5
E4 9.55 9.75
Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7447,
360 CBGA Package
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
45