33889 Datasheet, PDF (58/60 Pages) Freescale Semiconductor, Inc – System Basis Chip with Low Speed Fault Tolerant CAN Interface

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
80
70
60
50
40
30
x R_θJA
20
10
0
0
300
600
Heat spreading area A [mm²]
Figure 25. Device on Thermal Test Board R_θJA
100
10
x R_θJA
1
0.1
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
Time[s]
Figure 26. Transient Pin Resistance R_θJA
Device on Thermal Test Board Area A = 600 (mm²)
33889
58
Analog Integrated Circuit Device Data
Freescale Semiconductor