33889 Datasheet, PDF (57/60 Pages) Freescale Semiconductor, Inc – System Basis Chip with Low Speed Fault Tolerant CAN Interface

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
RX ¹
TX ²
VDD1 ³
RST ⁴
INT ⁵
GND ⁶
GND ⁷
GND ⁸
GND ⁹
V2CTRL ¹⁰
VSUP ¹¹
HS1 ¹²
L0 ¹³
L1 ¹⁴
28 _WDOG
27 _CS
26 _MOSI
25 _MISO
24 _SCLK
23 _GND
22 _GND
21 _GND
20 _GND
19 _CANL
18 _CANH
17 _RTL
16 _RTH
15 _V2
33889 Pin Connections
28-Pin SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
A
Figure 24. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 35. Thermal Resistance Performance
Thermal
Resistance
Area A (mm²)
(°C/W)
R_θJA
0
69
300
53
600
48
R_θJA is the thermal resistance between die junction and
ambient air.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33889
57