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33889 Datasheet, PDF (19/60 Pages) Freescale Semiconductor, Inc – System Basis Chip with Low Speed Fault Tolerant CAN Interface
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
VSUP From 5.5 V to 18 V, V2INT from 4.75 to 5.25 V and TJ from -40°C to 150°C unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Conditions
Symbol
Min
Typ
Max
Unit
Delay between SPI and “CAN normal mode”
SBC Normal mode (24)
tS-CANN
-
-
10
µs
Delay between SPI and “CAN sleep mode”
SBC Normal mode (24)
tS-CANS
-
-
10
µs
Delay between CS wake-up (CS low to high) and SBC
normal request mode (VDD1 on & reset high)
SBC in stop mode
tW-CS
15
40
90
µs
Delay between CS wake-up (CS low to high) and first
accepted SPI command
SBC in stop mode
tW-SPI
90
-
-
µs
Delay between INT pulse and 1st SPI command accepted
tS-1STSPI
20
-
In stop mode after wake-up
-
µs
Delay between two SPI messages addressing the same
register
For 33889D only
t2SPI
25
-
µs
-
INPUT PINS (L0 AND L1)
Wake-up Filter Time (enable/disable option on L0 input)
(If filter enabled)
tWUF
8.0
20
38
µs
PIN AC CHARACTERISTICS (CANH, CANL, RX, TX)
CANL and CANH Slew Rates (25% to 75% CAN signal). (25)
tSLDR
Recessive to Dominant state
2.0
2.0
Dominant to Recessive state
V/µs
8.0
9.0
Propagation Delay
TX to RX Low. -40°C < T ≤ 25°C. (26)
TX to RX Low. 25°C < T < 125°C. (26)
tONRX
Propagation Delay TX to RX High. (26)
tOFFRX
Notes
24. Guaranteed by design
25. Dominant to recessive slew rate is dependant upon the bus load characteristics.
26. AC Characteristics measured according to schematic Figure 4
µs
1.2
1.6
1.1
1.8
1.8
2.2
µs
Analog Integrated Circuit Device Data
Freescale Semiconductor
33889
19