K61P256M120SF3_1210 Datasheet, PDF (27/94 Pages) Freescale Semiconductor, Inc – K61 Sub-Family

Peripheral operating requirements and behaviors
2.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. Board meets JESD51-9 specification.
3.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
4.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
5.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
6.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
5.5 Power sequencing
Voltage supplies must be sequenced in the proper order to avoid damaging internal
diodes. There is no limit on how long after one supply powers up before the next supply
must power up. Note that V_DD and V_{DD_INT} can use the same power source.
The power-up sequence is:
1. V_DD
2. V_{DD_INT}
3. V_DDA
4. V_{DD_DDR}
The power-down sequence is the reverse:
1. V_{DD_DDR}
2. V_DDA
3. V_{DD_INT}
4. V_DD
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 Debug trace timing specifications
Table 12. Debug trace operating behaviors
Symbol
T_cyc
T_wl
Description
Clock period
Low pulse width
Min.
Max.
Frequency dependent
2
—
Table continues on the next page...
Freescale Semiconductor, Inc.
K61 Sub-Family Data Sheet, Rev. 4, 10/2012.
Unit
MHz
ns
27