MC68HC11E0CFNE3 Datasheet, PDF (177/242 Pages) Freescale Semiconductor, Inc – M68HC11E Family

Chapter 11
Ordering Information and Mechanical Specifications
11.1 Introduction
This section provides ordering information for the E-series devices grouped by:
• Standard devices
• Custom ROM devices
• Extended voltage devices
In addition, mechanical specifications for the following packaging options:
• 52-pin plastic-leaded chip carrier (PLCC)
• 52-pin windowed ceramic-leaded chip carrier (CLCC)
• 64-pin quad flat pack (QFP)
• 52-pin thin quad flat pack (TQFP)
• 56-pin shrink dual in-line package with .070-inch lead spacing (SDIP)
• 48-pin plastic DIP (.100-inch lead spacing), MC68HC811E2 only
11.2 Standard Device Ordering Information
Description
CONFIG
52-pin plastic leaded chip carrier (PLCC)
BUFFALO ROM
$0F
Temperature
–40°C to +85°C
No ROM
No ROM, no EEPROM
–40°C to +85°C
$0D
–40°C to +105°C
–40°C to +125°C
–40°C to +85°C
$0C
–40°C to +105°C
–40°C to +125°C
Frequency
2 MHz
3 MHz
2 MHz
3 MHz
2 MHz
2 MHz
2 MHz
3 MHz
2 MHz
2 MHz
MC Order Number
MC68HC11E9BCFN2
MC68HC11E9BCFN3
MC68HC11E1CFN2
MC68HC11E1CFN3
MC68HC11E1VFN2
MC68HC11E1MFN2
MC68HC11E0CFN2
MC68HC11E0CFN3
MC68HC11E0VFN2
MC68HC11E0MFN2
M68HC11E Family Data Sheet, Rev. 5.1
Freescale Semiconductor
177