MC68HC705E5 Datasheet, PDF (144/148 Pages) Freescale Semiconductor, Inc – General Release Specification

Mechanical Data
Freescale Semiconductor, Inc.
16.4 28-Pin Small Outline Integrated Circuit Package (Case 751F-04)
28
1
-T-
-A-
15
-B-
14X P
0.010 (0.25) ^M B ^M
14
28X D
0.010 (0.25) ^M T A S B S
M
R X 45°
26X G
C
-T-
SEATING
PLANE
K
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 17.80 18.05 0.701 0.711
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M
0°
8°
0°
8°
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
General Release Specification
Mechanical Data
For More Information On This Product,
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MC68HC705E5 — Rev. 1.0