English
Language : 

PD488588 Datasheet, PDF (56/79 Pages) Elpida Memory – 288M bits Direct Rambus DRAM
µPD488588
27. Timing Conditions
Timing Conditions
Symbol
Parameter
MIN.
tCYCLE
CTM and CFM cycle times
-C60
3.33
-C71
2.81
-C80
2.50
tCR, tCF
CTM and CFM input rise and fall times
0.2
tCH, tCL
CTM and CFM high and low times
40%
tTR
CTM-CFM differential
(MSE/MS=0/0)
0.0
(MSE/MS=1/1) Note1
0.9
tDCW
Domain crossing window
–0.1
tDR, tDF
tS, tH
DQA/DQB/ROW/COL input rise/fall times
DQA/DQB/ROW/COL-to-CFM
tCYCLE=2.50ns
setup/hold time
tCYCLE=2.81ns
tCYCLE=3.33ns
0.2
0.200 Note4
0.240 Note3,4
0.275 Note2,4
tDR1, tDF1
SIO0, SIO1 input rise and fall times
—
tDR2, tDF2
CMD,SCK input rise and fall times
—
tCYCLE1
SCK cycle time - Serial control register transactions
1,000
SCK cycle time - Power transitions
10
tCH1, tCL1
tS1
tH1
SCK high and low times
CMD setup time to SCK rising or falling edge Note5
CMD hold time to SCK rising or falling edge Note5
4.25
1.25
1
tS2
SIO0 setup time to SCK falling edge
40
tH2
SIO0 hold time to SCK falling edge
40
tS3
PDEV setup time on DQA5..0 to SCK rising edge
0
tH3
PDEV hold time on DQA5..0 to SCK rising edge
5.5
tS4
ROW2..0, COL4..0 setup time for quiet window Note6
–1
tH4
ROW2..0, COL4..0 hold time for quiet window
5
VIL, CMOS
VIH, CMOS
tNPQ
CMOS input low voltage - over / undershoot voltage
duration is less than or equal to 5 ns
CMOS input high voltage - over / undershoot voltage
duration is less than or equal to 5ns
Quiet on ROW / COL bits during NAP / PDN entry
–0.7
VCMOS/2 + 0.6
4
tREADTOCC Offset between read data and CC packets (same device)
12
tCCSAMTOREAD Offset between CC packet and read data (same device)
8
tCE
CTM/CFM stable before NAP/PDN exit
2
tCD
CTM/CFM stable after NAP/PDN entry
100
tFRM
ROW packet to COL packet ATTN framing delay
7
tNLIMIT
Maximum time in NAP mode
—
tREF
Refresh interval
—
tCCTRL
Current control interval
34 tCYCLE
tTEMP
Temperature control interval
—
tTCEN
TCE command to TCAL command
150
tTCAL
TCAL command to quiet window
2
tTCQUIET
Quiet window (no read data)
140
tPAUSE
RDRAM delay (no RSL operations allowed)
—
tBURST
Interval after PDN or NAP (with self-refresh) exit in which
—
all banks of the RDRAM must be refreshed at least once.
MAX.
Unit
Figures
3.83
ns
Figure 30-1
3.83
3.83
0.5
ns
Figure 30-1
60%
tCYCLE
Figure 30-1
1.0
tCYCLE
Figure 22-1
1.0
Figure 30-1
+0.1
tCYCLE
Figure 35-1
0.65
ns
Figure 31-1
—
ns
Figure 31-1
—
—
5.0
ns
Figure 33-1
2.0
ns
Figure 33-1
—
ns
Figure 33-1
—
ns
Figure 33-1
—
ns
Figure 33-1
—
ns
Figure 33-1
—
ns
Figure 33-1
—
ns
Figure 33-1
—
ns
Figure 33-1
—
ns Figure 23-4, 33-2
—
ns Figure 23-4, 33-2
—
tCYCLE
Figure 23-4
—
tCYCLE
Figure 23-4
+(VCMOS/2–0.6) V
VCMOS + 0.7
V
—
—
—
—
—
—
10
32
100 ms
100
—
2
—
200
200
tCYCLE
tCYCLE
tCYCLE
tCYCLE
tCYCLE
tCYCLE
µs
ms
—
ms
tCYCLE
tCYCLE
tCYCLE
µs
µs
Figure 23-3
Figure 25-1
Figure 25-1
Figure 23-4
Figure 23-3
Figure 23-2
Figure 23-1
Figure 24-1
Figure 25-1
Figure 25-2
Figure 25-2
Figure 25-2
Figure 25-2
Figure 22-1
Figure 24-2
56
Data Sheet E0039N30 (Ver. 3.0)