XA3S500E-4PQG208I Datasheet, PDF (6/37 Pages) Xilinx, Inc – Proven advanced 90-nanometer process technology

R
Ordering Information
XA Spartan-3E FPGAs are available in Pb-free packaging
options for all device/package combinations. All devices are
in Pb-free packages only, with a “G” character to the order-
ing code. All devices are available in either I-Grade or
Q-Grade temperature ranges. Only the -4 speed grade is
available for the XA Spartan-3E family. See Table 2 for valid
device/package combinations.
Pb-Free Packaging
Example: XA3S250E -4 FT G 256 I
Device Type
Speed Grade
Package Type
Temperature Range:
I = I-Grade (T_J =
Q = Q-Grade (T_J
–40^oC to
= –40^oC
100^oC)
to 125^oC)
Number of Pins
Pb-free
DS635_06_121608
Device
Speed Grade
XA3S100E -4 Only
XA3S250E
XA3S500E
XA3S1200E
XA3S1600E
VQG100
CPG132
TQG144
PQG208
FTG256
FGG400
FGG484
Package Type / Number of Pins
100-pin Very Thin Quad Flat Pack (VQFP)
Temperature Range (T_J)
I I-Grade (–40°C to 100°C)
132-ball Chip-Scale Package (CSP)
Q Q-Grade (–40°C to 125°C)
144-pin Thin Quad Flat Pack (TQFP)
208-pin Plastic Quad Flat Pack (PQFP)
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
400-ball Fine-Pitch Ball Grid Array (FBGA)
484-ball Fine-Pitch Ball Grid Array (FBGA)
DS635 (v2.0) September 9, 2009
www.xilinx.com
Product Specification
6