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XA3S500E-4PQG208I Datasheet, PDF (21/37 Pages) Xilinx, Inc – Proven advanced 90-nanometer process technology
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Table 21: CLB Distributed RAM Switching Characteristics
Symbol
Description
Clock-to-Output Times
TSHCKO
Time from the active edge at the CLK input to data appearing on the
distributed RAM output
Setup Times
TDS
Setup time of data at the BX or BY input before the active transition at the
CLK input of the distributed RAM
TAS
Setup time of the F/G address inputs before the active transition at the CLK
input of the distributed RAM
TWS
Setup time of the write enable input before the active transition at the CLK
input of the distributed RAM
Hold Times
TDH
Hold time of the BX, BY data inputs after the active transition at the CLK
input of the distributed RAM
TAH, TWH
Hold time of the F/G address inputs or the write enable input after the active
transition at the CLK input of the distributed RAM
Clock Pulse Width
TWPH, TWPL Minimum High or Low pulse width at CLK input
-4
Min Max
-
2.35
0.46
-
0.52
-
0.40
-
0.15
-
0
-
1.01
-
Units
ns
ns
ns
ns
ns
ns
ns
Table 22: CLB Shift Register Switching Characteristics
Symbol
Description
Clock-to-Output Times
TREG
Time from the active edge at the CLK input to data appearing on the shift
register output
Setup Times
TSRLDS
Setup time of data at the BX or BY input before the active transition at the
CLK input of the shift register
Hold Times
TSRLDH
Hold time of the BX or BY data input after the active transition at the CLK
input of the shift register
Clock Pulse Width
TWPH, TWPL Minimum High or Low pulse width at CLK input
-4
Min Max
Units
-
4.16 ns
0.46
-
ns
0.16
-
ns
1.01
-
ns
DS635 (v2.0) September 9, 2009
www.xilinx.com
Product Specification
21