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XA3S500E-4PQG208I Datasheet, PDF (34/37 Pages) Xilinx, Inc – Proven advanced 90-nanometer process technology
R
Byte Peripheral Interface Configuration Timing
Table 42: Timing for BPI Configuration Mode
Symbol
Description
TCCLK1
TCCLKn
TMINIT
Initial CCLK clock period
CCLK clock period after FPGA loads ConfigRate setting
Setup time on CSI_B, RDWR_B, and M[2:0] mode pins before the rising
edge of INIT_B
TINITM
Hold time on CSI_B, RDWR_B, and M[2:0] mode pins after the rising
edge of INIT_B
TINITADDR Minimum period of initial A[23:0] address cycle;
LDC[2:0] and HDC are asserted and valid
BPI-UP:
(M[2:0]=<0:1:0>)
BPI-DN:
(M[2:0]=<0:1:1>)
TCCO
TDCC
TCCD
Address A[23:0] outputs valid after CCLK falling edge
Setup time on D[7:0] data inputs before CCLK rising edge
Hold time on D[7:0] data inputs after CCLK rising edge
Minimum Maximum
(see Table 34)
(see Table 34)
50
-
Units
ns
0
-
ns
5
5
TCCLK1
cycles
2
2
See Table 38
See Table 38
See Table 38
Table 43: Configuration Timing Requirements for Attached Parallel NOR Flash
Symbol
Description
Requirement
Units
TCE
(tELQV)
Parallel NOR Flash PROM chip-select
time
TCE ≤ TINITADDR
ns
TOE
(tGLQV)
Parallel NOR Flash PROM
output-enable time
TOE ≤ TINITADDR
ns
TACC
(tAVQV)
Parallel NOR Flash PROM read access
time
TACC ≤ 0.5TCCLKn(min) – TCCO – TDCC – PCB
ns
TBYTE
(tFLQV,
tFHQV)
For x8/x16 PROMs only: BYTE# to
output valid time(3)
TBYTE ≤ TINITADDR
ns
Notes:
1. These requirements are for successful FPGA configuration in BPI mode, where the FPGA provides the CCLK frequency. The post
configuration timing can be different to support the specific needs of the application loaded into the FPGA and the resulting clock source.
2. Subtract additional printed circuit board routing delay as required by the application.
3. The initial BYTE# timing can be extended using an external, appropriately sized pull-down resistor on the FPGA’s LDC2 pin. The resistor
value also depends on whether the FPGA’s HSWAP pin is High or Low.
DS635 (v2.0) September 9, 2009
www.xilinx.com
Product Specification
34