SMJ320C31_07 Datasheet, PDF (53/59 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

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PACKAGE OPTION ADDENDUM
21-May-2007
PACKAGING INFORMATION
Orderable Device
5962-9205803MXA
5962-9205803MXC
5962-9205803MYA
5962-9205804MXA
5962-9205804MXC
5962-9205804MYA
5962-9205805QXA
5962-9205805QYA
5962-9760601NXB
5962-9760601Q9A
SM320C31GFAM50
SM320C31GFAS60
SM320C31HFGM40
SM320C31HFGM50
SM320C31HFGS60
SMJ320C31GFAM40
SMJ320C31GFAM50
SMJ320C31GFAS60
SMJ320C31HFGM40
SMJ320C31HFGM50
SMJ320C31HFGS60
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CPGA
CPGA
CFP
CPGA
CPGA
CFP
CPGA
CFP
BQFP
Package
Drawing
GFA
GFA
HFG
GFA
GFA
HFG
GFA
HFG
PQ
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
XCEPT
CPGA
CPGA
CFP
CFP
CFP
CPGA
CPGA
CPGA
CFP
CFP
CFP
KGD
GFA
GFA
HFG
HFG
HFG
GFA
GFA
GFA
HFG
HFG
HFG
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
141 1
TBD
Call TI
N / A for Pkg Type
141 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
141 1
TBD
Call TI
N / A for Pkg Type
141 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
141 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
132 1 Green (RoHS & CU NIPDAU Level-4-260C-72 HR
no Sb/Br)
0
TBD
Call TI
Call TI
141 1
TBD
Call TI
N / A for Pkg Type
141 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
141 1
TBD
Call TI
N / A for Pkg Type
141 1
TBD
Call TI
N / A for Pkg Type
141 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
132 1
TBD
Call TI
N / A for Pkg Type
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
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