SMJ320C31_07 Datasheet, PDF (49/59 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

HFG (S-CQFP-F132)
”A”
34
2.025 (51,44) MAX
66
SMJ320C31, SMJ320LC31, SMQ320LC31
DIGITAL SIGNAL PROCESSORS
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
MECHANICAL DATA
CERAMIC QUAD FLATPACK WITH TIE-BAR
0.960 (24,38)
TYP SQ
0.945 (24,00)
0.800 (20,32) TYP SQ
33
1
0.225 (5,72)
Tie Bar Width
0.175 (4,45)
132
1.210 (30,73)
TYP
2.015 (51,18)
100
1.990 (50,55)
67
99
0.061 (1,55)
0.059 (1,50) ^{DIA TYP}
“C”
“B”
0.013 (0,33)
132  _{0.006 (0,15)}
Braze
0.025 (0,64)
DETAIL “A”
0.040 (1,02)
0.030 (0,76)
0.020 (0,51) MAX
DETAIL “B”
0.010 (0,25)
0.005 (0,12)
0.014 (0,36)
0.002 (0,05)
0.116 (2,95) MAX
DETAIL “C”
4040231-8 / F 04/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Ceramic quad flatpack with flat leads brazed to non-conductive tie bar carrier.
D. This package can be hermetically sealed with a metal lid.
E. The terminals will be gold plated.
Thermal Resistance Characteristics†
PARAMETER °C/W
R_θJA
44.3
R_θJC
2.1
† _{Falls within MIL-STD-1835 CMGA7-PN and CMGA19-PN and JEDEC MO-067AG and MO-066AG, respectively}
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