LSM6DS0 Datasheet, PDF (32/59 Pages) STMicroelectronics – Embedded temperature sensor

Application hints
5
Application hints
Figure 20. LSM6DS0 electrical connections
Vdd_IO
C2
100 nF
GND
LSM6DS0
Vdd
RES
INT
RES
5
1
(TOP VIEW)
9
13
Vdd
RES
Cap
C3
C4
100 nF
GND
10 μF
GND
*C1
10nF(16V)
GND
* C1 must guarantee 1 nF value under
11 V bias condition
GND
5.1
External capacitors
The device core is supplied through the Vdd line. Power supply decoupling capacitors (C2,
C3 = 100 nF ceramic, C4 = 10 μF Al) should be placed as near as possible to the supply pin
of the device (common design practice).
The functionality of the device and the measured acceleration/angular rate data is
selectable and accessible through the SPI/I²C interface.
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DocID025604 Rev 3