LSM6DS3 Datasheet, PDF (15/100 Pages) STMicroelectronics – always-on 3D accelerometer and 3D gyroscope

LSM6DS3
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Overview
Overview
The LSM6DS3 is a system-in-package featuring a high-performance 3-axis digital
accelerometer and 3-axis digital gyroscope.
The integrated power-efficient modes are able to reduce the power consumption down to
1.25 mA in high-performance mode, combining always-on low-power features with superior
sensing precision for an optimal motion experience for the consumer thanks to ultra-low
noise performance for both the gyroscope and accelerometer.
The LSM6DS3 delivers best-in-class motion sensing that can detect orientation and
gestures in order to empower application developers and consumers with features and
capabilities that are more sophisticated than simply orienting their devices to portrait and
landscape mode.
The event-detection interrupts enable efficient and reliable motion tracking and contextual
awareness, implementing hardware recognition of free-fall events, 6D orientation, tap and
double-tap sensing, activity or inactivity, and wakeup events.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch mode
sensors. In addition, the LSM6DS3 can efficiently run the sensor-related features specified
in Android, saving power and enabling faster reaction time. In particular, the LSM6DS3 has
been designed to implement hardware features such as significant motion, tilt, pedometer
functions, timestamping and to support the data acquisition of an external magnetometer
with ironing correction (hard, soft).
The LSM6DS3 offers hardware flexibility to connect the pins with different mode
connections to external sensors to expand functionalities such as adding a sensor hub, etc.
Up to 8 kbyte of FIFO with dynamic allocation of significant data (i.e. external sensors,
timestamp, etc.) allows overall power saving of the system.
Like the entire portfolio of MEMS sensor modules, the LSM6DS3 leverages on the robust
and mature in-house manufacturing processes already used for the production of
micromachined accelerometers and gyroscopes. The various sensing elements are
manufactured using specialized micromachining processes, while the IC interfaces are
developed using CMOS technology that allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the sensing element.
The LSM6DS3 is available in a small plastic land grid array (LGA) package of
2.5 x 3.0 x 0.83 mm to address ultra-compact solutions.
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