LSM6DS3 Datasheet, PDF (1/100 Pages) STMicroelectronics – always-on 3D accelerometer and 3D gyroscope

LSM6DS3
iNEMO inertial module:
always-on 3D accelerometer and 3D gyroscope
Datasheet - production data
LGA-14L
(2.5 x 3 x 0.83 mm) typ.
Features
 Power consumption: 0.9 mA in combo normal mode
and 1.25 mA in combo high-performance mode up to
1.6 kHz.
 “Always-on” experience with low power
consumption for both accelerometer and gyroscope
 Smart FIFO up to 8 kbyte based on features set
 Compliant with Android K and L
 Hard, soft ironing for external magnetic sensor
corrections
 ±2/±4/±8/±16 g full scale
 ±125/±245/±500/±1000/±2000 dps full scale
 Analog supply voltage: 1.71 V to 3.6 V
 Independent IOs supply (1.62 V)
 Compact footprint, 2.5 mm x 3 mm x 0.83 mm
 SPI/I²C serial interface with main processor data
synchronization feature
 Embedded temperature sensor
 ECOPACK^®, RoHS and “Green” compliant
Applications
 Pedometer, step detector and step counter
 Significant motion and tilt functions
 Indoor navigation
 Tap and double-tap detection
 IoT and connected devices
 Intelligent power saving for handheld devices
 Vibration monitoring and compensation
 Free-fall detection
 6D orientation detection
Description
The LSM6DS3 is a system-in-package featuring a 3D
digital accelerometer and a 3D digital gyroscope
performing at 1.25 mA (up to 1.6 kHz ODR) in high-
performance mode and enabling always-on low-power
features for an optimal motion experience for the
consumer.
The LSM6DS3 supports main OS requirements,
offering real, virtual and batch sensors with 8 kbyte for
dynamic data batching.
ST’s family of MEMS sensor modules leverages the
robust and mature manufacturing processes already
used for the production of micromachined
accelerometers and gyroscopes.
The various sensing elements are manufactured using
specialized micromachining processes, while the IC
interfaces are developed using CMOS technology that
allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the
sensing element.
The LSM6DS3 has a full-scale acceleration range of
±2/±4/±8/±16 g and an angular rate range of
±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the
LSM6DS3 the preferred choice of system designers for
the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array
(LGA) package.
Table 1. Device summary
Part number
Temperature
range [°C]
Package
Packing
LSM6DS3
LSM6DS3TR
-40 to +85
-40 to +85
LGA-14L
(2.5 x 3 x 0.83 mm)
Tray
Tape &
Reel
February 2016
This is information on a product in full production.
DocID026899 Rev 8
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