S71GL032A Datasheet, PDF (90/102 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and RAM

Advance Information
Type 1 SRAM
4/8 Megabit CMOS SRAM
Common Features
„ Process Technology: Full CMOS
„ Power Supply Voltage: 2.7~3.3V
„ Three state outputs
Version
F
G
C
D
Density
4Mb
4Mb
8Mb
8Mb
Organization
(I_SB1, Max.)
x8 or x16 (note 1)
x8 or x16 (note 1)
x8 or x16 (note 1)
X16
Standby
(I_CC2, Max.)
10 µA
10 µA
15 µA
TBD
Operating
22 mA
22 mA
22 mA
TBD
Notes:
1. UB#, LB# swapping is available only at x16. x8 or x16 select by BYTE# pin.
Pin Description
Mode
Dual CS, UB# / LB# (tCS)
Dual CS, UB# / LB# (tCS)
Dual CS, UB# / LB# (tCS)
Dual CS, UB# / LB# (tCS)
Pin Name
Description
I/O
CS1#, CS2
Chip Selects
I
OE#
Output Enable
I
WE#
Write Enable
I
BYTE#
Word (V_CC)/Byte (V_SS) Select
I
A0~A17 (4M)
A0~A18 (8M)
Address Inputs
I
SA
Address Input for Byte Mode
I
I/O0~I/O15
Data Inputs/Outputs
I/O
V_CC
Power Supply
-
V_SS
Ground
-
DNU
Do Not Use
-
NC
No Connection
-
90
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005