S71GL032A Datasheet, PDF (10/102 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and RAM

Advance Information
Ordering Information
The order number is formed by a valid combinations of the following:
S71GL
032 A 80 BA W 0
F0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
See the Valid Combinations table.
PACKAGE MODIFIER
0 = 7 x 9 mm, 1.2 mm height, 56 balls (TLC056)
TEMPERATURE RANGE
W = Wireless (-25°C to +85°C)
I
= Industrial (-40°C to +85°C)
PACKAGE TYPE
BA = Fine-pitch BGA Lead (Pb)-free compliant package
BF = Fine-pitch BGA Lead (Pb)-free package
pSRAM DENSITY
80 = 8 Mb pSRAM
40 = 4 Mb pSRAM
08 = 8 Mb SRAM
04 = 4 Mb SRAM
PROCESS TECHNOLOGY
A = 200 nm, MirrorBit Technology
FLASH DENSITY
064 = 64Mb
032 = 32Mb
PRODUCT FAMILY
S71GL Multi-chip Product (MCP)
3.0-volt Page Mode Flash Memory and RAM
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S71GL032A_00A0 March 31, 2005