S71GL032A Datasheet, PDF (79/102 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and RAM

Advance Information
Addresses
WE#
OE#
CE#
Data
RESET#
PBA for program
2AA for erase
SA for program buffer to flash
SA for sector erase
555 for chip erase
t_WC
t_AS
t_AH
t_WH
Data# Polling
PA
t_GHEL
t_POLL
t_WS
t_RH
t_CP
t_CPH
t_DS
t_DH
t_{WHWH1 or 2}
t_BUSY
PBD for program
55 for erase
29 for program buffer to flash
30 for sector erase
10 for chip erase
DQ7# D_OUT
RY/BY#
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D_OUT is the data written to the device.
4. Illustration shows device in word mode.
Figure 24. Alternate CE# Controlled Write (Erase/Program) Operation Timings
March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
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