S71GL032A Datasheet, PDF (42/102 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and RAM

Addresses
(x16)
27h
28h
29h
2Ah
2Bh
2Ch
2Dh
2Eh
2Fh
30h
31h
32h
33h
34h
35h
36h
37h
38h
39h
3Ah
3Bh
3Ch
Advance Information
Table 20. Device Geometry Definition
Data
00xxh
000xh
0000h
0005h
0000h
00xxh
00xxh
000xh
00x0h
000xh
00xxh
0000h
0000h
000xh
0000h
0000h
0000h
0000h
0000h
0000h
0000h
0000h
Description
Device Size = 2^N byte
0017h = 64 Mb, 0016h = 32Mb
Flash Device Interface description (refer to CFI publication 100)
0000h = x8-only bus devices
0001h = x16-only bus devices
0002h = x8/x16 bus devices
Max. number of byte in multi-byte write = 2^N
(00h = not supported)
Number of Erase Block Regions within device (01h = uniform device,
02h = boot device)
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
007Fh, 0000h, 0020h, 0000h = 32 Mb (-R1, -R2)
003Fh, 0000h, 0001h = 32 Mb (-R3, R4)
007Fh, 0000h, 0020h, 0000h = 64 Mb (-R1, -R2, -R8, -R9)
007Fh, 0000h, 0000h, 0001h = 64 Mb (-R3, -R4, -R5, -R6, -R7)
Erase Block Region 2 Information (refer to CFI publication 100)
003Eh, 0000h, 0000h, 0001h = 32 Mb (-R1, -R2)
007Eh, 0000h, 0000h, 0001h = 64 Mb (-R1, -R2, -R8, -R9)
0000h, 0000h, 0000h, 0000h = all others
Erase Block Region 3 Information (refer to CFI publication 100)
Erase Block Region 4 Information (refer to CFI publication 100)
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S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005