S71GL032A Datasheet, PDF (83/102 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and RAM

Advance Information
Capacitance
C_IN
C_OUT
Parameter
Description
Input Capacitance
Output Capacitance
Test Condition
T_A = 25°C, f = 1 MHz,
V_CC = V_CC(typ.)
Max
Unit
8
pF
8
Note: Tested initially and after any design or process changes that may affect these parameters.
Thermal Resistance
Parameter
Description
Test Conditions
θ _JA
Thermal Resistance (Junction to Ambient) Test conditions follow standard test methods
and procedures for measuring thermal
θ _JC
Thermal Resistance (Junction to Case) _{impedance, per EIA / JESD51.}
Note: Tested initially and after any design or process changes that may affect these parameters.
VFBGA Unit
55
°C/W
17
AC Test Loads and Waveforms
R1
V_CC
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
V_CC
10%
R2
GND
Rise Time: 1 V/ns
ALL INPUT PULSES
90%
90%
10%
Fall Time: 1 V/ns
Equivalent to:
THÉVENIN EQUIVALENT
OUTPUT
R_TH
V_TH
Figure 25. AC Test Loads and Waveforms
Parameters
3.0V V_CC
Unit
R1
22000
R2
22000
Ω
R_TH
11000
V_TH
1.50
V
March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
83