K5D5657DCM-F015 Datasheet, PDF (74/74 Pages) Samsung semiconductor – MCP Specification of 256Mb NAND and 256Mb Mobile SDRAM

K5D5657DCM-F015
Preliminary
MCP MEMORY
PACKAGE DIMENSION
107-Ball Fine pitch Ball Grid Array Package (measured in millimeters)
10.50±0.10
#A1
TOP VIEW
Units:millimeters
0.10 MAX
(Datum A)
#A1 INDEX MARK
10.50±0.10
A
0.80x9=7.20
10 9 8 7 6 5 4 3 2 1
B
A
B
C
D
(Datum B)
0.80
E
F
G
H
J
K
L
M
N
P
0.32±0.05
1.30±0.10
3.60
107-∅ 0.45±0.05
∅ 0.20 M A B
BOTTOM VIEW
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Revision 0.0
June 2003