K4C89183AF Datasheet, PDF (54/55 Pages) Samsung semiconductor – 288Mb x18 Network-DRAM2 Specification

K4C89183AF
Package Outline Drawing (FBGA 60ball, 1.0 x 1.0 mm)
#A1
10.50 ± 0.10
TOP VIEW
Window Mold Area
10.50 ± 0.10
1.00 x 5 = 5.00
1.50
65 4
2.50
1.50
1.00
321
#A1 Mark (Option)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.35 ± 0.05
1.10± 0.10
60 - ∅0.45 solder ball
BOTTOM VIEW
- 54 -
REV. 0.7 Jan. 2005