SAA7104E Datasheet, PDF (55/70 Pages) NXP Semiconductors – Digital video encoder

Philips Semiconductors
Digital video encoder
Product specification
SAA7104E; SAA7105E
10 THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R_th(j-a)
thermal resistance from junction to ambient
in free air
38⁽¹⁾
K/W
Note
1. The overall R_th(j-a) value can vary depending on the board layout. To minimize the effective R_th(j-a) all power and
ground pins must be connected to the power and ground layers directly. An ample copper area direct under the
SAA7104E; SAA7105E with a number of through-hole plating, which connect to the ground layer (four-layer board:
second layer), can also reduce the effective R_th(j-a). Please do not use any solder-stop varnish under the chip. In
addition the usage of soldering glue with a high thermal conductance after curing is recommended.
11 CHARACTERISTICS
T_amb = 0 to 70 °C (typical values excluded); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Supplies
V_DDA
V_DDD2,
V_DDD3,
V_DDD4
V_DDD1
I_DDA
I_DDD
Inputs
V_IL
V_IH
I_LI
C_i
analog supply voltage
digital supply voltage
digital supply voltage (DVO)
analog supply current
digital supply current
LOW-level input voltage
HIGH-level input voltage
input leakage current
input capacitance
3.15
3.3
3.15
3.3
note 1
note 2
1.045
1.1
1.425
1.5
1.71
1.8
2.375
2.5
3.135
3.3
1
110
1
175
V_DDD1 = 1.1 V, 1.5 V, 1.8 V
or 2.5 V; note 3
V_DDD1 = 3.3 V; note 3
pins RESET, TMS, TCK,
TRST and TDI
V_DDD1 = 1.1 V, 1.5 V, 1.8 V
or 2.5 V; note 3
V_DDD1 = 3.3 V; note 3
pins RESET, TMS, TCK,
TRST and TDI
clocks
data
I/Os at high-impedance
−0.1
−
−0.5
−
−0.5
−
V_DDD1 − 0.2 −
2
−
2
−
−
−
−
−
−
−
−
−
3.45
V
3.45
V
1.155
V
1.575
V
1.89
V
2.625
V
3.465
V
115
mA
200
mA
+0.2
V
+0.8
V
+0.8
V
V_DDD1 + 0.1 V
V_DDD1 + 0.3 V
V_DDD2 + 0.3 V
10
µA
10
pF
10
pF
10
pF
2004 Mar 04
55