CP3BT26 Datasheet, PDF (3/278 Pages) National Semiconductor (TI) – Reprogrammable Connectivity Processor with Bluetooth-R, USB, and CAN Interfaces

2.0 Features
CPU Features
„ Fully static RISC processor core, capable of operating
from 0 to 24 MHz with zero wait/hold states
„ Minimum 41.7 ns instruction cycle time with a 24-MHz in-
ternal clock frequency, based on a 12-MHz external input
„ 47 independently vectored peripheral interrupts
On-Chip Memory
„ 256K bytes reprogrammable Flash program memory
„ 8K bytes Flash data memory
„ 32K bytes of static RAM data memory
„ Addresses up to 12M bytes of external memory
Broad Range of Hardware Communications Peripherals
„ Bluetooth Lower Link Controller (LLC) including a shared
4.5K byte Bluetooth RAM and 1K byte Bluetooth Se-
quencer RAM
„ Universal Serial Bus (USB) 1.1 full-speed node
„ ACCESS.bus serial bus (compatible with Philips I²C bus)
„ CAN interface with 15 message buffers conforming to
CAN specification 2.0B active
„ 8/16-bit SPI, Microwire/Plus serial interface
„ Four-channel Universal Asynchronous Receiver/Trans-
mitter (UART), one channel has USART capability
„ Advanced Audio Interface (AAI) to connect to external 8/
13-bit PCM Codecs as well as to ISDN-Controllers
through the IOM-2 interface (slave only)
„ CVSD/PCM converter supporting one bidirectional audio
connection
General-Purpose Hardware Peripherals
„ 12-bit A/D Converter (ADC)
„ Dual 16-bit Multi-Function Timer (MFT)
„ Versatile Timer Unit with four subsystems (VTU)
„ Four-channel DMA controller
„ Timing and Watchdog Unit
„ Random Number Generator peripheral
Extensive Power and Clock Management Support
„ On-chip Phase Locked Loop
„ Support for multiple clock options
„ Dual clock and reset
„ Power-down modes
Flexible I/O
„ Up to 54 general-purpose I/O pins (shared with on-chip
peripheral I/O)
„ Programmable I/O pin characteristics: TRI-STATE out-
put, push-pull output, weak pull-up input, high-imped-
ance input
„ Schmitt triggers on general-purpose inputs
„ Multi-Input Wake-Up (MIWU) capability
Power Supply
„ I/O port operation at 2.5V to 3.3V
„ Core logic operation at 2.5V
„ On-chip power-on reset
Temperature Range
„ -40°C to +85°C (Industrial)
Packages
„ LQFP-128, LQFP-144
Complete Development Environment
„ Pre-integrated hardware and software support for rapid
prototyping and production
„ Integrated environment
„ Project manager
„ Multi-file C source editor
„ High-level C source debugger
„ Comprehensive, integrated, one-stop technical support
Bluetooth Protocol Stack
„ Applications can interface to the high-level protocols or
directly to the low-level Host Controller Interface (HCI)
„ Transport layer support allows HCI command-based in-
terface over UART port
„ Baseband (Link Controller) hardware minimizes the
bandwidth demand on the CPU
„ Link Manager (LM)
„ Logical Link Control and Adaptation Protocol (L2CAP)
„ Service Discovery Protocol (SDP)
„ RFCOMM Serial Port Emulation Protocol
„ All packet types, piconet, and scatternet functionality
supported
CP3BT26 Connectivity Processor Selection Guide
NSID
Speed
(MHz)
Temp. Range
Program
Flash
(Kbytes)
Data
Flash
(Kbytes)
SRAM
(Kbytes)
External
Address
Lines
I/Os
Package
Type
CP3BT26G18NEP
24 -40° to +85°C 256
8
32
0
54 LQFP-128
CP3BT26G18NEPNOPB
24 -40° to +85°C 256
8
32
0
54 LQFP-128
CP3BT26G18NEPX
24 -40° to +85°C 256
8
32
0
54 LQFP-128
CP3BT26G18NEPXNOPB 24 -40° to +85°C 256
8
32
0
54 LQFP-128
CP3BT26Y98NEP
24 -40° to +85°C 256
8
32
23
48 LQFP-144
CP3BT26Y98NEPNOPB
24 -40° to +85°C 256
8
32
23
48 LQFP-144
CP3BT26Y98NEPX
24 -40° to +85°C 256
8
32
23
48 LQFP-144
CP3BT26Y98NEPXNOPB 24 -40° to +85°C 256
8
32
23
48 LQFP-144
NEP - Erased part (Bluetooth device address in Information Block 1); X - Tape and reel; NOPB - No lead solder
3
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