MC68HC05F8 Datasheet, PDF (122/126 Pages) Motorola, Inc – High-density complementary metal oxide semiconductor(HCMOS) microcontroller unit

Freescale Semiconductor, Inc.
14.2
64-pin QFP Package
L
48
49
33
32
-A-
L
Case No. 840C
64 lead QFP
-B-
B
V
B
B
P
- A, B, D -
Detail “A”
F
64
1
Detail “A”
17
16
-D-
A
0.20 M C A – B S D S
0.05 A – B
S
0.20 M H A – B S D S
Detail “C”
E
M
J
N
D
Section B–B
Base
Metal
0.20 M C A – B S D S
U
T
R
C
-C-
H
G
Seating
Plane
-H-
Datum
Plane
M
Q
K
W
X
Dim. Min. Max.
Notes
Dim. Min. Max.
A
13.90 14.10 _{1. Datum Plane –H– is located at bottom of lead and is coincident with} M
5° 10°
B
13.90 14.10
the lead where the lead exits the plastic body at the bottom of the _N
0.130 0.170
C
2.067
2.457
parting line.
2. Datums –A–, –B– and –D– to be determined at Datum Plane –H–.
P
D
0.30 0.45 _{3. Dimensions S and V to be determined at seating plane –C–.}
Q
0.40 BSC
2°
8°
E
2.00 2.40 ^{4. Dimensions A and B do not include mould protrusion. Allowable}
R
0.13 0.30
F
0.30
—
mould protrusion is 0.25mm per side. Dimensions A and B do
include mould mismatch and are determined at Datum Plane –H–.
S
16.20 16.60
G
0.80 BSC
5. Dimension D does not include dambar protrusion. Allowable
T
0.20 REF
H
0.067 0.250
dambar protrusion shall be 0.08 total in excess of the D dimension _U
9° 15°
J
0.130 0.230
at maximum material condition. Dambar cannot be located on the
lower radius or the foot.
V
16.20 16.60
K
0.50 0.66 _{6. Dimensions and tolerancing per ANSI Y 14.5M, 1982.}
W
0.042 NOM
L
12.00 REF ^{7. All dimensions in mm.}
X
1.10 1.30
14
Figure 14-2 64-pin QFP Mechanical Dimensions
MOTOROLA
14-2
MECHANICAL SPECIFICATIONS
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MC68HC05F8