MC68HC05F8 Datasheet, PDF (121/126 Pages) Motorola, Inc – High-density complementary metal oxide semiconductor(HCMOS) microcontroller unit

Freescale Semiconductor, Inc.
14
MECHANICAL SPECIFICATIONS
This section provides the mechanical dimension for the 56-pin SDIP and 64-pin QFP packages
for the MC68HC05F8.
14.1
56-pin SDIP Package
-A-
L
H
56
29
Case No. 859-01
56 lead SDIP
-B-
1
28
M
J
0.25 M T B S
-T-
Seating
Plane
F
D
0.25 M T A S
C
K
G
E
N
P
Dim. Min. Max.
Notes
Dim.
A 51.69 52.45
H
B 13.72 14.22
J
1. Dimensions and tolerancing per ANSI Y 14.5 1982.
C
3.94 5.08 _{2. All dimensions in mm.}
K
D
0.36 0.56 3. Dimension L to centre of lead when formed parallel.
L
E
0.89 BSC
4. Dimensions A and B do not include mould flash. Allowable mould
M
flash is 0.25 mm.
F
0.81 1.17
N
G
1.778 BSC
P
Min. Max.
7.62 BSC
0.20 0.38
2.92 3.43
15.24 BSC
0° 15°
0.51 1.02
1.78 2.29
14
MC68HC05F8
Figure 14-1 56-pin SDIP Mechanical Dimensions
MECHANICAL SPECIFICATIONS
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MOTOROLA
14-1