LAN8700 Datasheet, PDF (58/74 Pages) SMSC Corporation – ±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR TM in a Small Footprint

LAN8700/LAN8700i
7.0 DC ELECTRICAL CHARACTERISTICS
7.1 DC Characteristics
7.1.1 MAXIMUM RATINGS
Stresses beyond those listed in may cause permanent damage to the device. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
TABLE 7-1: MAXIMUM CONDITIONS
Parameter
Conditions
MIN
VDD33,VDDIO Power pins to all other pins. -0.5
Digital IO
To VSS ground
-0.5
VSS
VSS to all other pins
-0.5
Operating
LAN8700-AEZG
0
Temperature
Operating
LAN8700i-AEZG
-40
Temperature
Storage
-55
Temperature
TYP MAX Units
Comment
+3.6 V
+3.6 V
+4.0 V
+70 C
+85 C
+150 C
Table 7-5, “MII Bus
Interface Signals,” on
page 60
Commercial temperature
components.
Industrial temperature
components.
TABLE 7-2:
Parameter
All Pins
System
System
All Pins
ESD AND LATCH-UP PERFORMANCE
Conditions
MIN TYP MAX Units
ESD PERFORMANCE
Human Body Model
EN/IEC61000-4-2 Contact
Discharge
EN/IEC61000-4-2 Air-gap
Discharge
±8
kV
±8
kV
±15 kV
LATCH-UP PERFORMANCE
EIA/JESD 78, Class II
150
mA
Comments
Device
3rd party system test
3rd party system test
7.1.1.1 Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and manufacturing,
and is done without power applied to the IC. To pass the test, the device must have no change in operation or perfor-
mance due to the event. All pins on the LAN8700 provide ±8kV HBM protection.
7.1.1.2 IEN/IEC61000-4-2 Performance
The EN/IEC61000-4-2 ESD specification is an international standard that addresses system-level immunity to ESD
strikes while the end equipment is operational. In contrast, the HBM ESD tests are performed at the device level with
the device powered down.
Microchip contracts with Independent laboratories to test the LAN8700 to EN/IEC61000-4-2 in a working system.
Reports are available upon request. Please contact your Microchip representative, and request information on 3rd party
ESD test results. The reports show that systems designed with the LAN8700 can safely dissipate ±15kV air discharges
and ±8kV contact discharges per the EN/IEC61000-4-2 specification without additional board level protection.
In addition to defining the ESD tests, EN/IEC61000-4-2 also categorizes the impact to equipment operation when the
strike occurs (ESD Result Classification). The LAN8700 maintains an ESD Result Classification 1 or 2 when subjected
to an EN/IEC61000-4-2 (level 4) ESD strike.
Both air discharge and contact discharge test techniques for applying stress conditions are defined by the
EN/IEC61000-4-2 ESD document.
DS00002260A-page 58
 2007-2016 Microchip Technology Inc.