PIC24HJ12GP201_11 Datasheet, PDF (192/262 Pages) Microchip Technology – High-Performance, 16-bit Microcontrollers 5-cycle latency

PIC24HJ12GP201/202
TABLE 22-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 3.0V to 3.6V
DC CHARACTERISTICS
(unless otherwise stated)
Operating temperature -40°C ≤TA ≤+85°C for Industrial
-40°C ≤TA ≤+125°C for Extended
Parameter
No.
Typical⁽¹⁾
Max
Units
Conditions
Power-Down Current (IPD)⁽²⁾
DC60d
55
500
μA
-40°C
DC60a
DC60b
63
500
μA
+25°C
3.3V Base Power-Down Current^(3,4)
85
500
μA
+85°C
DC60c
146
1000
μA
+125°C
DC61d
8
13
μA
-40°C
DC61a
DC61b
10
15
μA
+25°C
3.3V Watchdog Timer Current: ΔIWDT^(3,5)
12
20
μA
+85°C
DC61c
13
25
μA
+125°C
Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated.
2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled to VSS, WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
3: The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
4: These currents are measured on the device containing the most memory in this family.
5: These parameters are characterized, but are not tested in manufacturing.
TABLE 22-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤TA ≤+85°C for Industrial
-40°C ≤TA ≤+125°C for Extended
Parameter No.
Typical⁽¹⁾
Max
Doze
Ratio⁽²⁾
Units
Conditions
DC73a
11
35
1:2
mA
DC73f
11
30
1:64
mA
-40°C 3.3V
40 MIPS
DC73g
11
30
1:128
mA
DC70a
11
50
1:2
mA
DC70f
11
30
1:64
mA +25°C 3.3V
40 MIPS
DC70g
11
DC71a
12
30
1:128
mA
50
1:2
mA
DC71f
12
30
1:64
mA +85°C 3.3V
40 MIPS
DC71g
12
30
1:128
mA
DC72a
12
50
1:2
mA
DC72f
12
30
1:64
mA +125°C 3.3V
40 MIPS
DC72g
12
30
1:128
mA
Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated.
2: Parameters with DOZE ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
DS70282E-page 192
© 2007-2011 Microchip Technology Inc.