MV78200 Datasheet, PDF (68/128 Pages) –

MV78200
Hardware Specifications
9.3
Thermal Power Dissipation (Preliminary)
.
Table 31: Thermal Power Dissipation
Interface
Core
Embedded CPU
(Relevant for both VDD_CPU0 and
VDD_CPU1)
RGMII 1.8V interface
DDR2 DIMM interface (72-bit) ODT
Miscellaneous
(Device Bus interface, TWSI, JTAG, MPP,
SPI, UART)
PCI Express interface
Symbol
P_VDD
P_{VDD_CPU}
P_{VDD_GE}
P_{VDD_M}
P_MISC
P_PEX
USB interface
SATA interface
P_USB
P_SATA
Test Conditions
Two CPUs, 1 GHz, VDD_CPU=1.1V
Ty p
1200
4200
Units
mW
mW
One Port, VDD_GE=1.8V
M_CLK=333 MHz
90
mW
1675 mW
300
mW
For one PCI Express interface in x4
400
mW
mode
For one USB port
70
mW
For one SATA port
180
mW
Notes:
1. The values are for nominal voltage.
2. Trace load is 5 pF unless otherwise specified.
3. Power in mW is calculated using the typical recommended VDDIO specification for each power
rail.
MV-S104671-U0 Rev. C
Page 68
Document Classification: Proprietary Information
Copyright © 2008 Marvell
December 6, 2008, Preliminary