MV78200 Datasheet, PDF (23/128 Pages) –

Pin Information
Pin Descriptions
2.2.2
Miscellaneous Pin Assignment
The Miscellaneous signal list contains clocks, reset, and PLL related signals.
Table 4: Miscellaneous Pin Assignments
Pin Name
I/O Pin
Ty p e
Power
Rail
Description
REF_CLK_SSC I
CMOS
VDDO_C
25 MHz reference clock input for TCLK PLL and PCLK (CPU core,
Mbus-L, and SDRAM clock) PLL. Supports a SSC source clock.
NOTE: REF_CLK_SSC voltage swing is according to VDDO_C.
REF_CLK_PT
I
CMOS VDDO_C 25 MHz reference clock input for USB 2.0 PHY, GbE interface,
and SATA PHY. Must be a pure tone clock.
NOTES:
• If the SSC clock is not required, REF_CLK_PT can be
configured via reset strapping to also drive the PCLK and TCLK
PLLs. In this configuration, tie REF_CLK_SSC to VSS.
• REF_CLK_PT voltage swing is according to VDDO_C.
SYSRSTn
I
CMOS VDDO_C System Reset
Main reset signal of the device.
Used to reset all units to their initial state.
NOTE: For reset timing, see in the MV76100, MV78100, and
MV78200 Design Guide.
SYSRST_OUTn O
CMOS
See
descrpition
Open Drain Reset Output
Reset request from the device to the board reset logic.
The power rail in use is determined by the MPP pin used for
SYSRST_OUTn:
• VDDO_B (DEV_AD[21], DEV_AD[24], DEV_AD[29],
DEV_AD[30], DEV_AD[31])
• VDDO_C (MPP[13])
TCLK_OUT
O CMOS VDDO_C TCLK PLL Output.
NOTES:
• TCLK_OUT pin can be configured to drive a clock running at 1:N
of TCLK rate, rather than TCLK PLL output.
• If using an external TCLK_IN core clock input rather than the
internally generated TCLK, leave TCLK_OUT not connected.
TCLK_OUT voltage swing is according to VDDO_C.
TCLK_IN
I
CMOS VDDO_C Core Clock Input (150 MHz–200 MHz). An alternative to the
internally generated TCLK. De-skewed inside the chip to 0 skew
between the input to the internal clock tree. Useful for high speed
synchronous interface operation.
NOTES:
• If using the internally generated TCLK, connect TCLK_IN to
VSS.
• The TCLK_IN voltage swing is according to VDDO_C.
THERMAL_A
THERMAL_C
I
Analog
Temperature diode anode/cathode
THERMAL_A and THERMAL_C provide connectivity to the on-chip
temperature diode that can be used to determine the die junction
temperature.
NOTE: When unused can be left unconnected.
Copyright © 2008 Marvell
December 6, 2008, Preliminary
Document Classification: Proprietary Information
MV-S104671-U0 Rev. C
Page 23