MC908JL8CDWE Datasheet, PDF (196/212 Pages) Freescale Semiconductor, Inc – Microcontrollers

Mechanical Specifications
18.3 20-Pin Small Outline Integrated Circuit Package (SOIC)
–A–
20
11
–B– 10X P
0.010 (0.25) M B M
1
10
20X D
J
0.010 (0.25) M T A S B S
F
18X G
C
–T–
SEATING
PLANE
M
K
R X 45_{_}
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 12.65 12.95 0.499 0.510
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0_{_} 7_{_} 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
Figure 18-2. 20-Pin SOIC (Case #751D)
18.4 28-Pin Plastic Dual In-Line Package (PDIP)
28
1
A
HG
F
15
B
14
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 36.45 37.21
B 13.72 14.22
C 3.94 5.08
D 0.36 0.56
F 1.02 1.52
G
2.54 BSC
H 1.65 2.16
J 0.20 0.38
K 2.92 3.43
L
15.24 BSC
M
0° 15°
N 0.51 1.02
INCHES
MIN MAX
1.435 1.465
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0° 15°
0.020 0.040
Figure 18-3. 28-Pin PDIP (Case #710)
MC68HC908JL8/JK8 • MC68HC08JL8/JK8 • MC68HC908KL8 Data Sheet, Rev. 3.1
196
Freescale Semiconductor