BCM43907 Datasheet, PDF (9/128 Pages) Cypress Semiconductor – WICED™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications Processor

BCM43907 Preliminary Data Sheet
Table of Contents
Section 17: Interface Timing and AC Characteristics .................................................... 99
Ethernet MAC (MII/RMII) Interface Timing ................................................................................................ 99
MII Receive Packet Timing.................................................................................................................... 99
MII Transmit Packet Timing................................................................................................................. 100
RMII Receive Packet Timing ............................................................................................................... 101
RMII Transmit Packet Timing .............................................................................................................. 102
I²S Master and Slave Mode TX Timing ................................................................................................... 103
SDIO Interface Timing .............................................................................................................................. 105
SDIO Default-Speed Mode Timing...................................................................................................... 105
SDIO High-Speed Mode Timing.......................................................................................................... 106
SDIO Bus Timing Specifications in SDR Modes ................................................................................. 107
Clock Timing ................................................................................................................................ 107
Device Input Timing ..................................................................................................................... 108
Device Output Timing................................................................................................................... 109
S/PDIF Interface Timing ........................................................................................................................... 110
SPI Flash Timing....................................................................................................................................... 112
Read-Register Timing ......................................................................................................................... 112
Write-Register Timing.......................................................................................................................... 113
Memory Fast-Read Timing.................................................................................................................. 114
Memory-Write Timing .......................................................................................................................... 115
SPI Flash Parameters ......................................................................................................................... 116
USB PHY Electrical Characteristics and Timing ................................................................................... 117
USB 2.0 and USB 1.1 Electrical and Timing Parameters.................................................................... 117
USB 2.0 Timing Diagrams................................................................................................................... 119
Section 18: Power-Up Sequence and Timing ............................................................... 122
Sequencing of Reset and Regulator Control Signals ........................................................................... 122
Description of Control Signals ............................................................................................................. 122
Control Signal Timing Diagrams.......................................................................................................... 123
Section 19: Thermal Information.................................................................................... 124
Package Thermal Characteristics ........................................................................................................... 124
Junction Temperature Estimation and PSI_JT Versus THETA_JC ........................................................... 124
Environmental Characteristics................................................................................................................ 124
Section 20: Mechanical Information .............................................................................. 125
Section 21: Ordering Information .................................................................................. 126
Broadcom^®
March 12, 2016 • 43907-DS104-R
BROADCOM CONFIDENTIAL
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