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BCM43907 Datasheet, PDF (54/128 Pages) Cypress Semiconductor – WICED™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications Processor
BCM43907 Preliminary Data Sheet
Pinout and Signal Descriptions
Section 9: Pinout and Signal Descriptions
Figure 15 shows the bump map of the WLCSP package.
Figure 15: 316-Bump WLCSP Map
Broadcom®
March 12, 2016 • 43907-DS104-R
BROADCOM CONFIDENTIAL
Page 53