HMC704LP4E Datasheet, PDF (10/44 Pages) Hittite Microwave Corporation – 8 GHz fractionaL-N PLL

v04.0215
Outline Drawing
HMC704LP4E
8 GHZ FRACTIONAL-N PLL
NOTES:
[1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED.
[2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
[3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
[4] DIMENSIONS ARE IN INCHES [MILLIMETERS].
[5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
[6] PAD BURR LENGTH SHALL BE 0.15 mm MAX. PAD BURR HEIGHT SHALL BE 0.05 mm MAX.
[7] PACKAGE WARP SHALL NOT EXCEED 0.05 mm
[8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
[9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Table 4. Package Information
Part Number
Package Body Material
Lead Finish
HMC704LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] 4-Digit lot number XXXX
[2] Max peak reflow temperature of 260°C
MSL Rating
MSL1^[2]
Package Marking ^[1]
H704
XXXX
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Trademarks and registered tradem_Aar_pks_par_le_icth_ae_tp_ir_oop_ner_sty_uof_pth_pei_or r_re_ts_:pe_Pct_hive_oo_nw_ene_:rs₉. _{78-250-3343 o}A_rpp_Rli_Fca_Mtio_Gn_-S_au_pp_pp_sor_@t:_aP_nho_an_loe:_g1_.-_c8_o0_m0-ANALOG-D
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