W25N01GVZEIT-TR Datasheet, PDF (66/68 Pages) Winbond – 3V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ

11. ORDERING INFORMATION
W = Winbond
25N = Serial SLC NAND Memory
01G = 1G-bit
W25N01GVxxIG/IT
W⁽¹⁾ 25N 01G V xx I⁽¹⁾
V = 2.7V to 3.6V
SF = 16-pin SOIC 300-mil
TB = 24-ball TFBGA 8x6-mm (5x5 ball array)
ZE = 8-pad WSON 8x6mm
TC = 24-ball TFBGA 8x6-mm (6x4 ball array)
I = Industrial (-40°C to +85°C)
(2)
G=
T=
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
and BUF=1 is the default value after power up
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
and BUF=0 is the default value after power up
Notes:
1. The “W” prefix is not included on the part marking.
2. Standard bulk shipments are in tray for WSON and TFBGA packages. For other packing options, please specify
when placing orders.
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