W25N01GVZEIT-TR Datasheet, PDF (4/68 Pages) Winbond – 3V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ

W25N01GVxxIG/IT
10.1 8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 61
10.2 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 62
10.3 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)......................................... 63
10.4 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 Ball Array)............................................ 64
11. ORDERING INFORMATION .......................................................................................................... 65
11.1 Valid Part Numbers and Top Side Marking ........................................................................ 66
12. REVISION HISTORY...................................................................................................................... 67
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