W25N01GVZEIT-TR Datasheet, PDF (23/68 Pages) Winbond – 3V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ

W25N01GVxxIG/IT
8. INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25N01GV consists of 27 basic instructions that are
fully controlled through the SPI bus (see Instruction Set Table1, 2). Instructions are initiated with the falling
edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code. Data
on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in Figures 5 through
29. All read instructions can be completed after any clocked bit. However, all instructions that Write,
Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been clocked)
otherwise the instruction will be ignored. This feature further protects the device from inadvertent writes.
Additionally, while the device is performing Program or Erase operation, BBM management, Page Data
Read or OTP locking operations, BUSY bit will be high, and all instructions except for Read Status Register
or Read JEDEC ID will be ignored until the current operation cycle has completed.
8.1 Device ID and Instruction Set Tables
8.1.1 Manufacturer and Device Identification
MANUFACTURER ID
(MF7 - MF0)
Winbond Serial Flash
EFh
Device ID
W25N01GV
(ID15 - ID0)
AA21h
- 22 -
Publication Release Date: March 21, 2016
Revision G