W25N01GVZEIT-TR Datasheet, PDF (10/68 Pages) Winbond – 3V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ

W25N01GVxxIG/IT
3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
Figure 1c. W25N01GV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB & TC)
3.6 Ball Description TFBGA 8x6-mm
BALL NO.
PIN NAME
I/O
FUNCTION
B2
CLK
I
Serial Clock Input
B3
GND
Ground
B4
VCC
Power Supply
C2
/CS
I
Chip Select Input
C4
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)⁽²⁾
D2
DO (IO1)
I/O
Data Output (Data Input Output 1)⁽¹⁾
D3
DI (IO0)
I/O
Data Input (Data Input Output 0)⁽¹⁾
D4
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)⁽²⁾
Multiple
NC
No Connect
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD functions are only available for Standard/Dual SPI.
-9-