DS90UB925Q-Q1 Datasheet, PDF (43/51 Pages) Texas Instruments – 5 to 85 MHz 24-Bit Color FPD-Link III Serializer With Bidirectional Control Channel

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DS90UB925Q-Q1
SNLS407D – APRIL 2012 – REVISED OCTOBER 2014
10.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown below:
Figure 28. No Pullback WQFN, Single Row Reference Diagram
Table 8. No Pullback WQFN Stencil Aperture Summary
DEVICE
PIN MKT Dwg PCB I/O PCB
COUN
Pad Size PITCH
T
(mm) (mm)
PCB DAP STENCIL I/O
SIZE (mm) APERTURE
(mm)
DS90UB925
Q-Q1
48
SQA48A
0.25 x
0.6
0.5
5.1 x 5.1
0.25 x 0.7
STENCIL
DAP
Aperture
(mm)
1.1 x 1.1
NUMBER of
DAP
APERTURE
OPENINGS
16
GAP BETWEEN
DAP APERTURE
(Dim A mm)
0.2
Figure 29. 48-Pin WQFN Stencil Example of Via and Opening Placement
Figure 30 PCB layout example is derived from the layout design of the DS90UB925QSEVB Evaluation Board.
The graphic and layout description are used to determine both proper routing and proper solder techniques when
designing the Serializer board.
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