CD00237391 Datasheet, PDF (167/177 Pages) STMicroelectronics – ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM

STM32F20xxx
Revision history
Table 94. Document revision history (continued)
Date
Revision
Changes
13-Jul-2010
Added USB OTG_FS features in Section 2.2.28: Universal serial bus
on-the-go full-speed (OTG_FS).
Updated V_{CAP_1} and V_{CAP_2} capacitor value to 2.2 µF in Figure 17:
Power supply scheme.
Removed DAC, modified ADC limitations, and updated I/O
compensation for 1.8 to 2.1 V range in Table 13: Limitations depending
on the operating power supply range.
Added V_BORL, V_BORM, V_BORH and I_RUSH in Table 17: Embedded reset
and power control block characteristics.
Removed table Typical current consumption in Sleep mode with Flash
memory in Deep power down mode. Merged typical and maximum
current consumption sections and added Table 18: Typical and
maximum current consumption in Run mode, code with data
processing running from Flash memory (ART accelerator disabled),
Table 19: Typical and maximum current consumption in Run mode,
code with data processing running from Flash memory (ART
accelerator enabled) or RAM, Table 20: Typical and maximum current
consumption in Sleep mode, Table 21: Typical and maximum current
consumptions in Stop mode, Table 22: Typical and maximum current
consumptions in Standby mode, and Table 23: Typical and maximum
current consumptions in VBAT mode.
Update Table 32: Main PLL characteristics and added Section 5.3.11:
PLL spread spectrum clock generation (SSCG) characteristics.
Added Note 8 for CIO in Table 44: I/O static characteristics.
4
Updated Section 5.3.18: TIM timer characteristics.
(continued) ^{Added T}NRST_OUT ^{in Table 47: NRST pin characteristics.}
Updated Table 50: I2C characteristics.
Removed 8-bit data in and data out waveforms from Figure 45: ULPI
timing diagram.
Removed note related to ADC calibration in Table 65. Section 5.3.20:
12-bit ADC characteristics: ADC characteristics tables merged into one
single table; tables ADC conversion time and ADC accuracy removed.
Updated Table 66: DAC characteristics.
Updated Section 5.3.22: Temperature sensor characteristics and
Section 5.3.23: VBAT monitoring characteristics.
Update Section 5.3.26: Camera interface (DCMI) timing specifications.
Added Section 5.3.27: SD/SDIO MMC card host interface (SDIO)
characteristics, and Section 5.3.28: RTC characteristics.
Added Section 6.2: Thermal characteristics. Updated Table 89:
LQFP176 - Low profile quad flat package 24 × 24 × 1.4 mm package
mechanical data and Figure 81: LQFP176 - Low profile quad flat
package 24 × 24 × 1.4 mm, package outline.
Changed tape and reel code to TX in Table 92: Ordering information
scheme.
Added Table 93: Main applications versus package for STM32F2xxx
microcontrollers. Updated figures in Appendix A.3: USB OTG full
speed (FS) interface solutions and A.4: USB OTG high speed (HS)
interface solutions. Updated Figure 92: Audio player solution using
PLL, PLLI2S, USB and 1 crystal and Figure 93: Audio PLL (PLLI2S)
providing accurate I2S clock.
Doc ID 15818 Rev 9
167/177