CD00237391 Datasheet, PDF (146/177 Pages) STMicroelectronics – ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM

Package characteristics
STM32F20xxx
Figure 76. WLCSP64+2 - 0.400 mm pitch wafer level chip size package outline
A1 ball location
D
e1
e
Detail A
E
Wafer back side
A2
A
Side view
Detail A
rotated by 90 °C
eee
e
e1
G
F
Bump side
A1
b
Seating plane
A0FX_ME
1. Drawing is not to scale.
Table 86. WLCSP64+2 - 0.400 mm pitch wafer level chip size package mechanical data
Symbol
millimeters
inches
Min
Typ
Max
Min
Typ
Max
A
0.520
0.570
0.600
0.0205
0.0224
0.0236
A1
0.170
0.190
0.210
0.0067
0.0075
0.0083
A2
0.350
0.380
0.410
0.0138
0.0150
0.0161
b
0.245
0.270
0.295
0.0096
0.0106
0.0116
D
3.619
3.639
3.659
0.1425
0.1433
0.1441
E
3.951
3.971
3.991
0.1556
0.1563
0.1571
e
0.400
0.0157
e1
3.218
0.1267
F
0.220
0.0087
G
0.386
0.0152
eee
0.050
0.0020
146/177
Doc ID 15818 Rev 9