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CD00237391 Datasheet, PDF (154/177 Pages) STMicroelectronics – ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM | |||
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Package characteristics
STM32F20xxx
6.2
Thermal characteristics
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ÎJA)
Where:
â TA max is the maximum ambient temperature in °C,
â ÎJA is the package junction-to-ambient thermal resistance, in °C/W,
â PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
â PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL à IOL) + Σ((VDD â VOH) à IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 91. Package thermal characteristics
Symbol
Parameter
Thermal resistance junction-ambient
LQFP 64 - 10 Ã 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
WLCSP64+2 - 0.400 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 Ã 14 mm / 0.5 mm pitch
ÎJA
Thermal resistance junction-ambient
LQFP144 - 20 Ã 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP176 - 24 Ã 24 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFBGA176 - 10Ã 10 mm / 0.5 mm pitch
Value
45
51
46
40
38
39
Unit
°C/W
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
154/177
Doc ID 15818 Rev 9
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