CD00253742 Datasheet, PDF (14/120 Pages) STMicroelectronics – XL-density performance line ARM-based 32-bit MCU

Description
STM32F103xF, STM32F103xG
2.2
Full compatibility throughout the family
The STM32F103xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are
identified as low-density devices, the STM32F103x8 and STM32F103xB are referred to as
medium-density devices, the STM32F103xC, STM32F103xD and STM32F103xE are
referred to as high-density devices and the STM32F103xF and STM32F103xG are called
XL-density devices.
Low-density, high-density and XL-density devices are an extension of the STM32F103x8/B
medium-density devices, they are specified in the STM32F103x4/6, STM32F103xC/D/E and
STM32F103xF/G datasheets, respectively. Low-density devices feature lower Flash
memory and RAM capacities, less timers and peripherals. High-density devices have higher
Flash memory and RAM capacities, and additional peripherals like SDIO, FSMC, I²S and
DAC. XL-density devices bring even more Flash and RAM memory, and extra features,
namely an MPU, a greater number of timers and a dual bank Flash structure while
remaining fully compatible with the other members of the family.
The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD, STM32F103xE,
STM32F103xF and STM32F103xG are a drop-in replacement for the STM32F103x8/B
devices, allowing the user to try different memory densities and providing a greater degree
of freedom during the development cycle.
Moreover, the STM32F103xx performance line family is fully compatible with all existing
STM32F101xx access line and STM32F102xx USB access line devices.
Table 3. STM32F103xx family
Low-density
devices
Medium-density
devices
High-density devices
XL-density devices
16 KB 32 KB 64 KB
Pinout Flash Flash⁽¹⁾ Flash
128 KB
Flash
256 KB
Flash
384 KB 512 KB
Flash Flash
768 KB Flash
1 MB Flash
6 KB
RAM
10 KB
RAM
20 KB
RAM
20 KB
RAM
48 or
64 KB⁽²⁾
RAM
64 KB
RAM
64 KB
RAM
96 KB RAM 96 KB RAM
144
100
2 × USARTs
64 2 × 16-bit timers
1 × SPI, 1 × I²C,
USB, CAN,
1 × PWM timer
48 ^{2 × ADCs}
36
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I²Cs,
USB, CAN,
1 × PWM timer
2 × ADCs
5 × USARTs
4 × 16-bit timers,
2 × basic timers
3 × SPIs, 2 × I²Ss, 2 × I2Cs
USB, CAN, 2 × PWM timers
3 × ADCs, 2 × DACs,
1 × SDIO
FSMC (100- and 144-pin
packages⁽³⁾)
5 × USARTs
10 × 16-bit timers,
2 × basic timers
3 × SPIs, 2 × I²Ss, 2 × I2Cs
USB, CAN, 2 × PWM timers
3 × ADCs, 2 × DACs, 1 × SDIO,
Cortex-M3 with MPU
FSMC (100- and 144-pin
packages⁽⁴⁾), dual bank Flash
memory
1. For orderable part numbers that do not show the A internal code after the temperature range code (6 or 7), the reference
datasheet for electrical characteristics is that of the STM32F103x8/B medium-density devices.
2. 64 KB RAM for 256 KB Flash are available on devices delivered in CSP packages only.
3. Ports F and G are not available in devices delivered in 100-pin packages.
4. Ports F and G are not available in devices delivered in 100-pin packages.
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Doc ID 16554 Rev 3