CD00253742 Datasheet, PDF (110/120 Pages) STMicroelectronics – XL-density performance line ARM-based 32-bit MCU

Package characteristics
STM32F103xF, STM32F103xG
Figure 61. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline
C ^{Seating plane}
A2
A4
ddd C
A3
B
D
D1
e
F
A
A1
A
M
F
E1 E
e
Ball A1
Øb (144 balls)
Øeee M ^{C A B}
Ø fff M C
X3_ME
1. Drawing is not to scale.
Table 68.
Symbol
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data
millimeters
inches⁽¹⁾
Min
Typ
Max
Typ
Min
Max
A
1.70
0.0669
A1
0.21
0.0083
A2
1.07
0.0421
A3
0.27
0.0106
A4
0.85
0.0335
b
0.35
0.40
0.45
0.0138
0.0157
0.0177
D
9.85
10.00
10.15
0.3878
0.3937
0.3996
D1
8.80
0.3465
E
9.85
10.00
10.15
0.3878
0.3937
0.3996
E1
8.80
0.3465
e
0.80
0.0315
F
0.60
0.0236
ddd
0.10
0.0039
eee
0.15
0.0059
fff
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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Doc ID 16554 Rev 3