CD00253742 Datasheet, PDF (113/120 Pages) STMicroelectronics – XL-density performance line ARM-based 32-bit MCU

STM32F103xF, STM32F103xG
Package characteristics
Figure 66. LQFP64 – 10 x 10 mm 64 pin low-profile
quad flat package outline⁽¹⁾
Figure 67. Recommended footprint⁽¹⁾⁽²⁾
48
49
b
64
Pin 1
identification ₁
D
D1
D3
33
ccc C
A
A2
32
48
33
0.3
49
0.5
32
12.7 _10.3
E3 E1 E
17
16
c
L1
A1
L
K
5W_ME
10.3
64
17
1.2
1
16
7.8
12.7
ai14909
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 71. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
A
1.600
0.0630
A1
0.050
0.150
0.0020
0.0059
A2
1.350
1.400
1.450
0.0531
0.0551
0.0571
b
0.170
0.220
0.270
0.0067
0.0087
0.0106
c
0.090
0.200
0.0035
0.0079
D
11.800
12.000
12.200
0.4646
0.4724
0.4803
D1
9.800
10.000
10.200
0.3858
0.3937
0.4016
D.
7.500
E
11.800
12.000
12.200
0.4646
0.4724
0.4803
E1
9.800
10.00
10.200
0.3858
0.3937
0.4016
e
0.500
0.0197
k
0°
3.5°
7°
0°
3.5°
7°
L
0.450
0.600
0.75
0.0177
0.0236
0.0295
L1
1.000
0.0394
ccc
0.080
0.0031
Number of pins
N
64
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 16554 Rev 3
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