CD00253742 Datasheet, PDF (111/120 Pages) STMicroelectronics – XL-density performance line ARM-based 32-bit MCU

STM32F103xF, STM32F103xG
Package characteristics
Figure 62. LQFP144, 20 x 20 mm, 144-pin low-profile quad
flat package outline⁽¹⁾
Seating plane
C
Figure 63. Recommended
footprint⁽¹⁾⁽²⁾
A A2 A1
b
ccc C
D
D1
D3
108
109
c
73
72
0.25 mm
gage plane
k
108
109
0.35
A1
L
0.5
L1
73 ^1.35
72
17.85
19.9
22.6
E1 E
E3
144
1
19.9
22.6
37
36
ai149
144
Pin 1
1
identification
37
36
e
1. Drawing is not to scale.
2. Dimensions are in millimeters.
ME_1A
Table 69.
Symbol
LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data
millimeters
inches⁽¹⁾
Min
Typ
Max
Min
Typ
Max
A
1.60
0.063
A1
0.05
0.15
0.002
0.0059
A2
1.35
1.40
1.45
0.0531
0.0551
0.0571
b
0.17
0.22
0.27
0.0067
0.0087
0.0106
c
0.09
0.20
0.0035
0.0079
D
21.80
22.00
22.20
0.8583
0.8661
0.874
D1
19.80
20.00
20.20
0.7795
0.7874
0.7953
D3
17.50
0.689
E
21.80
22.00
22.20
0.8583
0.8661
0.874
E1
19.80
20.00
20.20
0.7795
0.7874
0.7953
E3
17.50
0.689
e
0.50
0.0197
L
0.45
0.60
0.75
0.0177
0.0236
0.0295
L1
1.00
0.0394
k
0°
3.5°
7°
0°
3.5°
7°
ccc
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 16554 Rev 3
111/120