CD00253742 Datasheet, PDF (109/120 Pages) STMicroelectronics – XL-density performance line ARM-based 32-bit MCU

STM32F103xF, STM32F103xG
6
Package characteristics
Package characteristics
6.1
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 60. Recommended PCB design rules (0.80/0.75 mm pitch BGA
Dpad
Dsm
Dpad
0.37 mm
Dsm
0.52 mm typ. (depends on solder mask
registration tolerance
Solder paste 0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
ai15469
Doc ID 16554 Rev 3
109/120