CD00253742 Datasheet, PDF (114/120 Pages) STMicroelectronics – XL-density performance line ARM-based 32-bit MCU

Package characteristics
STM32F103xF, STM32F103xG
6.2
Thermal characteristics
The maximum chip junction temperature (T_Jmax) must never exceed the values given in
Table 10: General operating conditions on page 41.
The maximum chip-junction temperature, T_J max, in degrees Celsius, may be calculated
using the following equation:
T_J max = T_A max + (P_D max x Θ_JA)
Where:
● T_A max is the maximum ambient temperature in °C,
● Θ_JA is the package junction-to-ambient thermal resistance, in ° C/W,
● P_D max is the sum of P_INT max and P_I/O max (P_D max = P_INT max + P_I/Omax),
● P_INT max is the product of I_DD and V_DD, expressed in Watts. This is the maximum chip
internal power.
P_I/O max represents the maximum power dissipation on output pins where:
P_I/O max = Σ (V_OL × I_OL) + Σ((V_DD – V_OH) × I_OH),
taking into account the actual V_OL / I_OL and V_OH / I_OH of the I/Os at low and high level in the
application.
Table 72. Package thermal characteristics
Symbol
Parameter
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Θ_JA
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Value
40
30
46
45
Unit
°C/W
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
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Doc ID 16554 Rev 3